High-Throughput Microwave Package for Precise Superconducting Device Measurement

• URL: http://arxiv.org/abs/2512.18198v1
• Date: Sat, 20 Dec 2025 03:45:20 GMT
• Title: High-Throughput Microwave Package for Precise Superconducting Device Measurement
• Authors: Wei-Ren Syong, Allie Miller, Emma Davis, John R. Pitten, Jorge Ramirez, Nathan Ortiz, Michael Vissers, Doug Bennett, Corey Rae Harrington McRae,
• Abstract summary: We outline the design and experimental demonstration of a wirebond-free, PCB-free, drop-in microwave package for on-chip superconducting quantum devices.<n>The package is composed of a superconducting aluminum cavity with a suspended tungsten transmission pin.
• Score: 0.0
• License: http://creativecommons.org/licenses/by/4.0/
• Abstract: Cryogenic microwave measurement of superconducting quantum devices is complicated by the packaging required to connect devices to control and readout circuitry. In this work, we outline the design and experimental demonstration of a wirebond-free, PCB-free, drop-in microwave package for on-chip superconducting quantum devices. The package is composed of a superconducting aluminum cavity with a suspended tungsten transmission pin. The fundamental package cavity mode is far detuned from the 4 GHz to 8 GHz band of interest, and the pin transmission exhibits less than 3 dB of ripple across this range. We demonstrate the use of this package to extract the loss tangent of superconducting ring resonators, measuring a value of (1.10 +- 0.09) x 10^-6, which agrees with measurements of lambda/4 resonators in wirebond-based packaging. This high-throughput measurement system will allow the rapid generation of large datasets for improving superconducting qubit performance, and facilitate time-sensitive surface passivation and oxide regrowth studies.

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