Homogeneous Free-Standing Nanostructures from Bulk Diamond over Millimeter Scales for Quantum Technologies

• URL: http://arxiv.org/abs/2506.11198v2
• Date: Mon, 16 Jun 2025 15:49:33 GMT
• Title: Homogeneous Free-Standing Nanostructures from Bulk Diamond over Millimeter Scales for Quantum Technologies
• Authors: Andrea Corazza, Silvia Ruffieux, Yuchun Zhu, Claudio A. Jaramillo Concha, Yannik Fontana, Christophe Galland, Richard J. Warburton, Patrick Maletinsky,
• Abstract summary: Quantum devices based on optically addressable spin qubits in diamond are promising platforms for quantum technologies such as quantum sensing and communication.<n>We tackle this hurdle with an approach producing millimeter-scale, thin (down to 70 nm) and highly parallel membranes from single-crystal diamond.<n>The membranes remain contamination-free and possess atomically smooth surfaces as required by state-of-the-art quantum applications.
• Score: 0.0
• License: http://creativecommons.org/licenses/by-nc-nd/4.0/
• Abstract: Quantum devices based on optically addressable spin qubits in diamond are promising platforms for quantum technologies such as quantum sensing and communication. Nano- and microstructuring of the diamond crystal is essential to enhance device performance, yet fabrication remains challenging and often involves trade-offs in surface quality, aspect ratio, device size, and uniformity. We tackle this hurdle with an approach producing millimeter-scale, thin (down to 70 nm) and highly parallel (< 0.35 nm/$\mathrm{\mu m}$}) membranes from single-crystal diamond. The membranes remain contamination-free and possess atomically smooth surfaces ($\mathrm{R_q}$ < 200 pm) as required by state-of-the-art quantum applications. We demonstrate the benefits and versatility of our method by fabricating large fields of free-standing and homogeneous photonic nano- and microstructures. Leveraging a refined photolithography-based strategy, our method offers enhanced scalability and produces robust structures suitable for direct use, while remaining compatible with heterogeneous integration through pick-and-place transfer techniques.

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