Machine Learning based CVD Virtual Metrology in Mass Produced Semiconductor Process

• URL: http://arxiv.org/abs/2107.05071v1
• Date: Sun, 11 Jul 2021 15:32:31 GMT
• Title: Machine Learning based CVD Virtual Metrology in Mass Produced Semiconductor Process
• Authors: Yunsong Xie, Ryan Stearrett
• Abstract summary: A cross-benchmark has been done on three critical aspects, data imputing, feature selection and regression algorithms. The result reveals that linear feature selection regression algorithm would extensively under-fit the VM data. Data imputing is also necessary to achieve a higher prediction accuracy as the data availability is only 70% when optimal accuracy is obtained.
• Score: 0.0
• License: http://arxiv.org/licenses/nonexclusive-distrib/1.0/
• Abstract: A cross-benchmark has been done on three critical aspects, data imputing, feature selection and regression algorithms, for machine learning based chemical vapor deposition (CVD) virtual metrology (VM). The result reveals that linear feature selection regression algorithm would extensively under-fit the VM data. Data imputing is also necessary to achieve a higher prediction accuracy as the data availability is only ~70% when optimal accuracy is obtained. This work suggests a nonlinear feature selection and regression algorithm combined with nearest data imputing algorithm would provide a prediction accuracy as high as 0.7. This would lead to 70% reduced CVD processing variation, which is believed to will lead to reduced frequency of physical metrology as well as more reliable mass-produced wafer with improved quality.

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