Niobium coaxial cavities with internal quality factors exceeding 1.5 billion for circuit quantum electrodynamics

• URL: http://arxiv.org/abs/2403.00286v1
• Date: Fri, 1 Mar 2024 05:07:10 GMT
• Title: Niobium coaxial cavities with internal quality factors exceeding 1.5 billion for circuit quantum electrodynamics
• Authors: Andrew E. Oriani, Fang Zhao, Tanay Roy, Alexander Anferov, Kevin He, Ankur Agrawal, Riju Banerjee, Srivatsan Chakram, and David I. Schuster
• Abstract summary: Group-V materials such as niobium and tantalum have become popular choices for extending the performance of circuit quantum electrodynamics (cQED) platforms. The complex surface chemistry of niobium makes identifying the main modes of decoherence difficult at millikelvin temperatures and single-photon powers. We use niobium coaxial quarter-wave cavities to study the impact of etch chemistry, prolonged atmospheric exposure, and the significance of cavity conditions prior to and during cavities.
• Score: 37.74682733310708
• License: http://creativecommons.org/licenses/by/4.0/
• Abstract: Group-V materials such as niobium and tantalum have become popular choices for extending the performance of circuit quantum electrodynamics (cQED) platforms allowing for quantum processors and memories with reduced error rates and more modes. The complex surface chemistry of niobium however makes identifying the main modes of decoherence difficult at millikelvin temperatures and single-photon powers. We use niobium coaxial quarter-wave cavities to study the impact of etch chemistry, prolonged atmospheric exposure, and the significance of cavity conditions prior to and during cooldown, in particular niobium hydride evolution, on single-photon coherence. We demonstrate cavities with quality factors of $Q_{\rm int}\gtrsim 1.4\times10^{9}$ in the single-photon regime, a $15$ fold improvement over aluminum cavities of the same geometry. We rigorously quantify the sensitivity of our fabrication process to various loss mechanisms and demonstrate a $2-4\times$ reduction in the two-level system (TLS) loss tangent and a $3-5\times$ improvement in the residual resistivity over traditional BCP etching techniques. Finally, we demonstrate transmon integration and coherent cavity control while maintaining a cavity coherence of \SI{11.3}{ms}. The accessibility of our method, which can easily be replicated in academic-lab settings, and the demonstration of its performance mark an advancement in 3D cQED.

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