Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems

• URL: http://arxiv.org/abs/2509.10409v1
• Date: Fri, 12 Sep 2025 17:02:40 GMT
• Title: Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems
• Authors: Zefan Du, Pedro Chumpitaz Flores, Wenqi Wei, Juntao Chen, Kaixun Hua, Ying Mao,
• Abstract summary: This project introduces InterPlace, a self-adaptive, hardware-aware framework for chip-to-chip distributed quantum systems.<n>InterPlace analyzes qubit noise and error rates to construct a virtual system topology.<n>It guides circuit partitioning and distributed qubit mapping to minimize SWAP overhead and enhance fidelity.
• Score: 8.766014028665984
• License: http://arxiv.org/licenses/nonexclusive-distrib/1.0/
• Abstract: Quantum computing offers unparalleled computational capabilities but faces significant challenges, including limited qubit counts, diverse hardware topologies, and dynamic noise and error rates, which hinder scalability and reliability. Distributed quantum computing, particularly chip-to-chip connections, has emerged as a solution by interconnecting multiple processors to collaboratively execute large circuits. While hardware advancements, such as IBM's Quantum Flamingo, focus on improving inter-chip fidelity, limited research addresses efficient circuit cutting and qubit mapping in distributed systems. This project introduces InterPlace, a self-adaptive, hardware-aware framework for chip-to-chip distributed quantum systems. InterPlace analyzes qubit noise and error rates to construct a virtual system topology, guiding circuit partitioning and distributed qubit mapping to minimize SWAP overhead and enhance fidelity. Implemented with IBM Qiskit and compared with the state-of-the-art, InterPlace achieves up to a 53.0\% improvement in fidelity and reduces the combination of on-chip SWAPs and inter-chip operations by as much as 33.3\%, demonstrating scalability and effectiveness in extensive evaluations on real quantum hardware topologies.

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