Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor

• URL: http://arxiv.org/abs/2112.02717v2
• Date: Tue, 14 Jun 2022 10:10:01 GMT
• Title: Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor
• Authors: Sandoko Kosen, Hang-Xi Li, Marcus Rommel, Daryoush Shiri, Christopher Warren, Leif Gr\"onberg, Jaakko Salonen, Tahereh Abad, Janka Bizn\'arov\'a, Marco Caputo, Liangyu Chen, Kestutis Grigoras, G\"oran Johansson, Anton Frisk Kockum, Christian Kri\v{z}an, Daniel P\'erez Lozano, Graham Norris, Amr Osman, Jorge Fern\'andez-Pend\'as, Alberto Ronzani, Anita Fadavi Roudsari, Slawomir Simbierowicz, Giovanna Tancredi, Andreas Wallraff, Christopher Eichler, Joonas Govenius, Jonas Bylander
• Abstract summary: We have integrated single and coupled superconducting transmon qubits into flip-chip modules. We demonstrate time-averaged coherence times exceeding $90,mu s$, single-qubit gate fidelities exceeding $99.9%$, and two-qubit gate fidelities above $98.6%$.
• Score: 1.5465992780403517
• License: http://creativecommons.org/licenses/by/4.0/
• Abstract: We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged coherence times exceeding $90\,\mu s$, single-qubit gate fidelities exceeding $99.9\%$, and two-qubit gate fidelities above $98.6\%$. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

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