Fluxonium Qubits in a Flip-Chip Package

• URL: http://arxiv.org/abs/2303.01481v2
• Date: Mon, 11 Dec 2023 20:50:52 GMT
• Title: Fluxonium Qubits in a Flip-Chip Package
• Authors: Aaron Somoroff, Patrick Truitt, Adam Weis, Jacob Bernhardt, Daniel Yohannes, Jason Walter, Konstantin Kalashnikov, Mario Renzullo, Raymond A. Mencia, Maxim G. Vavilov, Vladimir E. Manucharyan, Igor V. Vernik, and Oleg Mukhanov
• Abstract summary: We report work on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump-bonded to the quantum chip. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high fidelity single-qubit gates with 6 ns microwave pulses, and identify the main decoherence mechanisms to improve on the reported results.
• Score: 0.6049992212584339
• License: http://creativecommons.org/licenses/by-nc-nd/4.0/
• Abstract: The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that minimizes crosstalk and decoherence. In this paper, we report work on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump-bonded to the quantum chip, forming a multi-chip module (MCM). The modular approach allows for improved connectivity between the qubits and control/readout elements, and separate fabrication processes. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high fidelity single-qubit gates with 6 ns microwave pulses (without DRAG), and identify the main decoherence mechanisms to improve on the reported results.

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