Characterization of process-related interfacial dielectric loss in
aluminum-on-silicon by resonator microwave measurements, materials analysis,
and imaging
- URL: http://arxiv.org/abs/2403.00723v1
- Date: Fri, 1 Mar 2024 18:16:28 GMT
- Title: Characterization of process-related interfacial dielectric loss in
aluminum-on-silicon by resonator microwave measurements, materials analysis,
and imaging
- Authors: Lert Chayanun, Janka Bizn\'arov\'a, Lunjie Zeng, Per Malmberg, Andreas
Nylander, Amr Osman, Marcus Rommel, Pui Lam Tam, Eva Olsson, August Yurgens,
Jonas Bylander, Anita Fadavi Roudsari
- Abstract summary: We investigate the influence of the fabrication process on dielectric loss in aluminum-on-silicon superconducting coplanar waveguide resonators.
These devices are essential components in superconducting quantum processors.
We identify the relative importance of reducing loss at the substrate-metal and the substrate-air interfaces.
- Score: 0.0
- License: http://creativecommons.org/licenses/by/4.0/
- Abstract: We systematically investigate the influence of the fabrication process on
dielectric loss in aluminum-on-silicon superconducting coplanar waveguide
resonators with internal quality factors ($Q_i$) of about one million at the
single-photon level. These devices are essential components in superconducting
quantum processors; they also serve as proxies for understanding the energy
loss of superconducting qubits. By systematically varying several fabrication
steps, we identify the relative importance of reducing loss at the
substrate-metal and the substrate-air interfaces. We find that it is essential
to clean the silicon substrate in hydrogen fluoride (HF) prior to aluminum
deposition. A post-fabrication removal of the oxides on the surface of the
silicon substrate and the aluminum film by immersion in HF further improves the
$Q_i$. We observe a small, but noticeable, adverse effect on the loss by
omitting either standard cleaning (SC1), pre-deposition heating of the
substrate to 300$\deg$C, or in-situ post-deposition oxidation of the film's top
surface. We find no improvement due to excessive pumping meant to reach a
background pressure below $6{\times} 10^{-8}$ mbar. We correlate the measured
loss with microscopic properties of the substrate-metal interface through
characterization with X-ray photoelectron spectroscopy (XPS), time-of-flight
secondary ion mass spectroscopy (ToF-SIMS), transmission electron microscopy
(TEM), energy-dispersive X-ray spectroscopy (EDS), and atomic force microscopy
(AFM).
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